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Leading Blind and Buried Vias PCB Manufacturer

Sep 12. 2025

Discover the key advantages of choosing a blind and buried vias PCB manufacturer to enhance your high-density interconnect projects with optimized space, flexibility, and signal integrity.

Sep 12. 2025, 11:57:34

HA30 CEM3 Thermal Conductivity Specs: Guiding Heat Management in Mid-Tier Electronics

Aug 27. 2025

HA30 CEM3 Thermal Conductivity Specs represent a critical benchmark for mid-tier composite epoxy substrates, defining the material’s ability to transfer thermal energy and guiding its selection for applications where heat dissipation is essential but extreme performance (and associated costs) of high-end substrates are unnecessary. Unlike generic CEM3, which offers inconsistent thermal performance across batches, HA30 CEM3 is engineered to meet precise thermal conductivity specifications—ensuring predictable heat transfer in devices ranging from LED lighting drivers to industrial sensor modules. These specs are not mere technical details; they serve as a roadmap for engineers, helping them match the substrate’s thermal capabilities to the heat loads of their designs, avoid overengineering, and balance performance with cost.In electronics where even small temperature increases can degrade component lifespan or cause performance drift (e.g., a 10°C rise in a power transistor can reduce i

Aug 27. 2025, 15:36:33

Design of High-Power PCB in High Temperature Environment

Aug 13. 2021

As the commonest components integrated platform, multi-layer PCBs connect circuit boards and components together. With electr

Aug 13. 2021, 17:22:11

BENEFITS OF HIGH FREQUENCY CIRCUIT BOARDS

Jul 09. 2021

First up, the benefit that high frequency PCBs offer is that they have high density and improved signals. It offers a f

Jul 09. 2021, 09:34:53

HIGH FREQUENCY PCBS

Jul 08. 2021

As complexity of electronic components increases, the one thing that becomes imperative is signal rates and high freque

Jul 08. 2021, 09:34:34

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