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APOLLOPCB attending the 2019 China Japan Electronic Circuit Conference and Autum

time:Mar 24. 2021, 16:07:19 Views:101

APOLLOPCB attending the 2019 China Japan Electronic Circuit Conference and Autumn International PCB technology / Information Forum

From October 31 to November 1, 2019, the 2019 China Japan electronic circuit autumn conference and the Autumn International PCB technology / Information Forum jointly sponsored by China Electronic Circuit Industry Association (CPCA) and JPCA (Japan Electronic Circuit Industry Association) and hosted by CPCA science and technology committee was held in Dongguan. APOLLOPCB Director Sam Lee was invited to participate in the conference, and have a deep communication with the Industry technologist.

The forum was last for two days, with the theme of "Create a New Era with Wisdom and Win in the Future ". Entrepreneurs, experts, engineering technicians and managers from China and Japan PCB industry will participate in the event. It is reported that nearly 100 articles have been received at the 2019 China Japan electronic circuit autumn conference and the Autumn International PCB technology / Information Forum. After careful review and selection by the industry expert group, a total of 75 papers with standard writing, clear expression, novel content and high practical value were included in the supplement (collection of papers) of Printed Circuit Information, which covers 11 categories of printed circuit design, graphic formation, drilling and machining technology.

APOLLOPCB attending the 2019 China Japan Electronic Circuit Conference and Autumn International PCB technology / Information Forum

Among them, APOLLOPCB's 6 papers was selected. They are Study on the Delamination of Multilayer Printed Circuit Board, Study on Improvement of Spilled Water in Wet Processing Production in Rigid-flex PCB, Discussion on Mechanism of PCB Chemical Immersion Tin and Failure of Tin Thickness and Solder Mask, Improvement of Electroless Nickel-palladium-gold Plating Leakage and False Plating, A Parameter Setting Method for Improving the Hanging |Copper in the Blind Hole and Analysis and Improvement of Gold Finger Deviation in Flexible Board Insertion and Removal. And the first three papers made wonderful speeches at the conference.

As the vice president unit of CPCA, APOLLOPCB has actively submitted papers to participate in the spring / Autumn International PCB technology / Information Forum organized by CPCA over the years, contributing to the technical progress and development of the industry.


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