Aluminum substrate is a metal-based copper clad laminate with good heat dissipation function. Let us understand the classification of PCB aluminum substrates below.

　　 One, flexible aluminum substrate

　　 One of the new developments of IMS materials is flexible dielectrics. These materials can provide excellent electrical insulation, flexibility and thermal conductivity. When applied to flexible aluminum materials, products can be formed to achieve various shapes and angles, which can eliminate expensive fixtures, cables and connectors.

　　 Two, mixed aluminum aluminum substrate

　　Common is a 2-layer or 4-layer sub-assembly made of traditional FR-4. Bonding this layer to an aluminum substrate with a thermoelectric can help dissipate heat, increase rigidity, and act as a shield.

　　 Three, multilayer aluminum substrate

　　 In the high-performance power supply market, multi-layer IMSPCB is made of multi-layer thermally conductive dielectric. These structures have one or more layers of circuits buried in the dielectric, and blind vias are used as thermal vias or signal paths.

　　Four, through-hole aluminum substrate

　　 In a complex structure, a layer of aluminum can form the "core" of the multilayer thermal structure. Before lamination, aluminum is electroplated and filled with dielectric in advance. Thermal materials or sub-components can be laminated to both sides of the aluminum using thermal adhesive materials. Once laminated, the finished assembly resembles a traditional multilayer aluminum substrate by drilling. Plated through holes pass through gaps in the aluminum to maintain electrical insulation.