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Disassembly and soldering skills of SMD integrated circuits

time:Mar 24. 2021, 16:43:13 Views:108

The disassembly operation process of the chip integrated circuit is as follows:

  ①Before disassembling, carefully observe the position and orientation of the integrated circuit to be disassembled on the circuit board, and make a mark so that the integrated circuit can be installed according to the corresponding mark during soldering to avoid installation errors.


  ②Use a small brush to clean up the impurities around the chip integrated circuit, and then apply a little rosin powder or rosin on the chip integrated circuit pins.


       ③Adjust the temperature and wind speed of the hot air gun. The temperature switch is generally adjusted to gear 3 to 5, and the wind speed switch is adjusted to gear 2 to 3.


       ④When disassembling with a single nozzle, pay attention to keep the nozzle and the removed integrated circuit vertical, and move along the pins around the integrated circuit, and evenly heat each pin. The nozzle should not touch the integrated circuit and surrounding peripheral components, and the position of the blow-welding Be accurate, and do not blow to the components around the integrated circuit.


       ⑤After the soldering tin of each pin of the integrated circuit is completely melted, use tweezers to lift or clamp the integrated circuit, and no force is used, otherwise the copper foil connected to the integrated circuit will be easily damaged.


For maintenance personnel who do not have a hot-air desoldering station or a hot-air gun, the following methods can be used to disassemble the post-chip integrated circuit: First, apply rosin to a certain column of the integrated circuit and connect all the pins of the column with solder, and then use electricity The soldering iron heats the solder. After the solder on the pins of the row is melted, use a thin blade (such as a scraper blade) to push it between the circuit board and the pins. Remove the soldering iron and wait a few seconds before taking out the blade. The pins of this column of the integrated circuit are separated from the circuit board, and then the other pins of the integrated circuit are separated from the circuit board in the same way, and finally the entire integrated circuit can be removed.


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