With the development of electronic products, customers have higher and higher requirements for the production of modular circuit boards, and the requirements for surface treatment have become more and more stringent. There is a very common process used in the surface treatment process, which is called the immersion gold process. This process can not only meet customers' increasingly complex assembly and soldering requirements for circuit boards, but also has a lower cost than electroplated nickel and gold.

　　Immersed gold is for immersion of nickel gold. The immersion gold process can effectively protect the side of the wire and prevent bad phenomena during use. In addition, the immersion gold process has a better function and helps improve the functional yield of the module circuit board, so even if the cost is higher than other surface treatment processes, its use is more common.

　　Let’s take a look at the role of its craftsmanship:

　　1. The copper on the circuit board is mainly red copper. The copper pad is easily oxidized in the air and will affect the function of the circuit board. The immersion gold process has a strong anti-oxidation function.

　　 2. With good heat dissipation, the lower the temperature of the circuit board, the more stable the chip will work. Immersion gold has strong thermal conductivity, and the pad made of it has good heat dissipation due to its good thermal conductivity.

　　3. It is generally used for circuit boards with relatively high requirements. The flatness is better. Immersion gold is generally used for this type, because the assembly of black pads will not occur normally. The flatness and service life of the gold-plated plate are very good, and the immersion gold process is equally good in this respect.

　　4. The most frequent complaints on the circuit board are functional problems such as poor contact of the pads. The process of immersion gold can greatly reduce the occurrence of such problems because of the strong conductivity of gold.