info@apollopcb.com

New here ? Getting $50 coupon

Request a quote
ABOUT US
COMPANY OVERVIEW MILESTONES FACTORY TOUR ORDER GUIDE QUALITY ASSURANCE PRIVACY POLICY PAYMENT METHODS SHIPPING METHODS APOLLOPCB DELIVERY VISIT US
PRODUCTS
PCB PCB ASSEMBLY COMPONENT SOURCING OEM
TECHNOLOGY
PCB CAPABILITIES PCB ASSEMBLY SUPPLY CHAIN MANAGEMENT SYSTEM CERTIFICATE QUALITY ASSURANCE
KNOWLEDGE CENTRE
PCB TYPE PCB ASSEMBLY LASER STENCIL PCB PRODUCTION
CULTURE
VALUE SYSTEM SOCIAL RESPONSIBILITY GREEN APOLLO CONFLICT MINERAL
NEWS
COMPANY NEWS INDUSTRY NEWS
CONTACT US
FEEDBACK GET A QUOTE

NEWS

New characteristics of the development of automotive communication module circuit boards

time:Jun 11. 2021, 18:53:01 Views:208


1. High energy/strong electricity

  1. High energy: The power IGBT (Insulated Gate Field Effect Transistor and Bipolar Transistor Combination) modules used in automotive communication module circuit boards, electric vehicle drive circuits and drive modules will generate 1000 to 2000W of heat.

2. New PCB board: New energy vehicle's medium and small power inverter speed control device, high power inverter speed control device, inverter device, induction heating device, reactive power compensation, active filter, communication (network) power supply must have Ceramic copper clad laminate, aluminum silicon carbide substrate material.

cpzx-tb1.png

  3. Based on LED lighting system

  4. Frequency conversion speed regulation device

   5. Strong current controller, connection box

   6. Inverter

   2. High-density interconnection (HDI) of automotive circuit boards

  1. Advantages: the size of the car circuit board is reduced, the number of layers is reduced; the inner layer has multiple wiring vacancies; reduces the risk of tin bridge short circuit; hot microvia;

  2. Laser drilling micro-hole application;

  3. High-density interconnection and special circuit boards (backplanes, high-frequency boards, metal substrates and thick copper foil boards, optoelectronic printing plates)

   Three, thick copper

  1. Strong current/thick copper plate technology: single and double-sided thick copper clad laminate; copper plating and copper etching; conductive surface (laminating, bonding)

  2. External wire/copper thickness and etching technology: green ink laminating process; thick copper copper clad laminate; printing and etching; thick copper and plug-in (laminated); mechanical manufacturing (wiring, stamping, water jet, laser)

  Four, automotive semi-flexible circuit boards and automotive high-speed copper-clad circuit boards (new high-speed materials)

  1. Insulating substrate of flexible board: Flexible insulating film can be used, requiring comprehensive consideration of the heat resistance, covering property, thickness, mechanical and electrical properties of the film;

2. Flexible board copper foil: The ductility and bending resistance of rolled copper foil are better than that of electrolytic copper foil. When the bending radius of electrolytic copper foil is less than 5MM or dynamic deflection, it is easy to break. For this reason, flexible circuit materials are mostly used for rolling Copper foil, suitable for multiple deflection.

  3. New high-speed material: reduce signal loss, ISOLAFR408 copper clad laminate


Previous Back to list Next

Instant Quote & Order Online

Upload your PCB Files

Got project ready to assembly? Contact us: info@apollopcb.com

GET PCB QUOTATION NOW
Verified by

Delivery Services

Payment Methods

Leave Message to APOLLOPCB

We're not around but we still want to hear from you! Leave us a note:

*indicates a required field

Name*
Email*
Message*

Leave Message to APOLLOPCB