1. Assembly adaptability-to adapt to various assembly equipment operations and technological processes

(1) SMT components must be placed on the circuit board with a placement machine before soldering. Therefore, the upper surface of the components should be suitable for picking up by the vacuum nozzle of the placement machine.

(2) The lower surface of SMT components (excluding solder ends) should reserve the space for the use of adhesive.

(3) The size and shape should be standardized, and have good dimensional accuracy and interchangeability.

(4) The packaging form is suitable for the automatic placement of the placement machine, and can protect the device from external forces during the handling process and keep the pins flat.

(5) It has certain mechanical strength and can withstand mounting stress and bending stress of circuit board.

2. Welding adaptability-to adapt to various welding equipment and related process flow

(1) The solder ends or pins of the components have good coplanarity, which meets the requirements of mounting and soldering.

(2) The materials and packages of the components have good high temperature resistance and are suitable for welding conditions:

Reflow soldering (235±5)℃, soldering time (5±0.2)s.

Wave soldering (250±5)℃, soldering time (4±0.5)s.

(3) It can withstand cleaning with organic solvents after soldering, and the packaging materials and surface markings must not be melted.

Requirements when picking up SMT components

During transportation, material separation, inspection or manual mounting, if the staff needs to take SMT devices, they should wear an anti-static wrist strap, try to use a suction pen to operate, and pay special attention to avoid bumping the pins of SOP, QFP and other devices. Prevent warping and deformation of pins.