High-density interconnector (HDI) is a high-density interconnection board, which is a circuit board with a relatively high line distribution density using blind and buried microvias. HDI board has inner layer lines and outer layer lines, and then uses processes such as drilling and metallization in the holes to connect the inside of each layer.

 HDI boards are usually manufactured by laminating methods. The more times the layer is stacked, the higher the technical level of the circuit board. Ordinary HDI boards are basically disposable laminates. High-end HDI uses two or more layers of technology and uses advanced PCB technologies, such as stacked holes, electroplated holes, and laser direct drilling.

 When the density of PCB increases to more than eight-layer boards, the cost of circuit boards manufactured with HDI will be lower than the traditional complex pressing process. HDI board promotes the use of advanced packaging technology, and its electrical performance and signal accuracy are higher than traditional PCB. In addition, HDI boards have better improvements in radio frequency interference, electromagnetic interference, electrostatic discharge, and heat conduction.

 Electronic products continue to develop towards high density and high precision. The so-called "high" not only improves machine performance, but also reduces the size of the machine. High-density integration (HDI) technology can make the final product design more compact, while meeting higher electronic performance and efficiency standards. Currently popular electronic products, such as mobile phones, digital (camera) cameras, notebook computers, automotive electronics, etc., mostly use HDI boards. With the upgrading of electronic products and market demand, the development of HDI boards will be very rapid.

General PCB introduction

PCB (printed circuit board) is the Chinese name of printed circuit board, also known as printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing, it is called a "printed" circuit board.

Its main function is to avoid manual wiring due to the consistency of the same printed board after the electronic equipment adopts a printed board, and can automatically insert or install electronic components, automatically solder and automatically detect electronic components. The quality of electronic equipment improves labor productivity, reduces costs, and facilitates maintenance.

HDI boards are high-density interconnect circuit boards, and blind hole plating and secondary pressing boards are HDI boards, which are divided into first-order, second-order, third-order, fourth-order, fifth-order and other HDI. For example, the motherboard of the iPhone 6 is a fifth-order HDI PCB.