Multi-layer PCBs are used as the "core main force" in the fields of communications, medical treatment, industrial control, security, automobiles, electric power, aviation, computer peripherals, etc. The product functions are getting higher and higher, and the PCB is getting more and more sophisticated, so it is more difficult to produce. Come bigger.

　　 1. Difficulties in the production of the inner line

　　 Multilayer board circuits have various special requirements for high speed, thick copper, high frequency, and high Tg value. The requirements for inner layer wiring and pattern size control are getting higher and higher. For example, the ARM development board has a lot of impedance signal lines in the inner layer. To ensure the integrity of the impedance increases the difficulty of the inner layer circuit production.

　　 There are many signal lines in the inner layer, and the width and spacing of the lines are basically about 4mil or less; the thin production of multi-core boards is prone to wrinkles, and these factors will increase the production of the inner layer.

　　Recommendation: The line width and line spacing are designed to be above 3.5/3.5mil (most factories have no difficulty in production).

　　For example, a six-layer board, it is recommended to use a fake eight-layer structure design, which can meet the impedance requirements of 50ohm, 90ohm, and 100ohm with 4-6mil line width in the inner layer.

　　 2. Difficulties in alignment between inner layers

　　 The number of multi-layer boards is increasing, and the alignment requirements of the inner layers are getting higher and higher. The film will expand and contract under the influence of the temperature and humidity of the workshop environment, and the core board will have the same expansion and contraction when produced, which makes it more difficult to control the alignment accuracy between the inner layers.